Model the interconnect region in detail rather than the full assembly.
Concentrating mesh density where the damage accumulates keeps the solution tractable without losing the governing physics.
Thermal-mechanical modelling of a solder interconnect to assess fatigue life and assembly reliability.
Solder interconnects fail from accumulated inelastic strain under thermal cycling rather than from a single overload event. The engineering question is how geometry and the material set influence that accumulation. [Editable placeholder — replace with the final project description.]
The work follows a model-first methodology: build a defensible geometry, define material behaviour appropriate to the load regime, verify numerical convergence, then evaluate life with a published fatigue correlation. [Editable placeholder.]
Geometry preparation and simplification
Material and boundary condition definition
Thermal-mechanical solution setup
Mesh sensitivity study
Inelastic strain extraction
Fatigue life assessment
Documentation and presentation
Concentrating mesh density where the damage accumulates keeps the solution tractable without losing the governing physics.
Published models are reviewable and comparable to literature.
No verified results published yet. Results will be added once the analysis is complete and reviewed — nothing is stated here that has not been measured or computed.
Mechanical & Simulation Engineer
Structural Engineer
Electronics & Test Engineer
Finalist